Zepoxy 2011
Zepoxy 2011 is an all-purpose epoxy adhesive useful for bonding of materials such as metal, wood, ceramic, FRP, concrete, textile, glass, leather, etc. It has higher bonding power as well as higher mechanical strength making this system a higher performance version of Zepoxy 2011.
Product Description
Zepoxy 2011 is an all-purpose epoxy adhesive useful for bonding of materials such as metal, wood, ceramic, FRP, concrete, textile, glass, leather, etc. It has higher bonding power as well as higher mechanical strength making this system a higher performance version of Zepoxy 2011.
Zepoxy 2011 is an all-purpose epoxy adhesive useful for bonding of materials such as metal, wood, ceramic, FRP, concrete, textile, glass, leather, etc. It has higher bonding power as well as higher mechanical strength making this system a higher performance version of Zepoxy 2011.
TECHNICAL DATA
|
Property |
Test Method |
Result |
|---|---|---|
|
Appearance Part A |
Visual |
High viscosity, translucent liquid |
|
Appearance Part B |
Visual |
High viscosity, yellow to brown |
|
Mix ratio (Part A: Part B) |
Theoretical |
100: 80 |
|
*Mix viscosity @ 25°C |
ASTM D 2196 |
30,000 – 55,000 cPs |
|
*Flash Point |
ASTM D 93 |
>135°C |
|
*Pot life (300g mix) @ 30°C |
- |
30m @ 280C |
|
*Gel time (18g mix) @ 30°C |
- |
2h @ 280C |
|
*Hardening time |
- |
24 hours |
|
*Full Cure |
- |
7 days |
|
*Flexural Strength |
ASTM D 790 |
66.9 MPa |
|
*Compressive Strength – Yield |
ASTM D 695 |
65.4 MPa |
|
*Compressive Strength – Ultimate |
ASTM D 695 |
116.2 MPa |
*Typical results under laboratory conditions.
NOTE
At 40°C gel time will be reduced to half, in case of increased temperatures, pouring should be planned accordingly
GENERAL INFORMATION
Substrate preparation: The substrate of the substrate must be clean and dry. Remove all dirt, grease and foreign material by cleaning with suitable solvent, sand blasting, mechanical abrasion, or acid etching.
Mixing: To obtain good results, thorough mixing of the ingredients is essential. Usually the resin and hardener are mixed in small quantities to extend the working time and prevent high exothermic reaction and pre-gelling.
Application: To ensure good adhesion between the substrates, it is recommended to apply rich layer of homogenous blend uniformly on the surface and fill the dents and pinholes. Adequate cuing normally takes place within 24 hours, post curing at temperatures more than 40°C is recommended.
Cleaning and maintenance of equipment: Tools and equipment used during the process are best cleaned immediately after use since removal of cured resin is difficult and time consuming. It is recommended that the bulk of the resin be removed using a scrapper and the remainder washed away using solvents such as toluene, xylene or acetone.
PACKAGING
Zepoxy 2011 is available as follows:
Mini set 180g Part A: 100g
Part B: 80g
Half Set 900g Part A: 500g
Part B: 400g
Full Set 1.8 KG Part A: 1 KG
Part B: 800g
Commercial Pack 54 KG Part A: 30 KG
Part B: 24 KG
HEALTH AND SAFETY
Dispose containers of the materials as per local laws, rules, and regulations. Use gloves, safety masks and other safety apparel as per health and safety laws. For further assistance, please refer to the MSDS of the product for further health and safety information.
