Zepoxy RER AW106

Zepoxy RER AW106 and Zepoxy REH 953U is a two-component epoxy adhesive system comprising of resin Zepoxy RER AW106 and hardener Zepoxy REH 953U. The adhesive is moderately reactive and cures at temperatures between 20°C to 180°C without the release of volatile components. It provides excellent adhesion and is suitable for bonding a variety of substrates.

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    Zepoxy RER AW106           100 Parts by Weight
    Zepoxy REH AW106           80 Parts by Weight
    Pot life at 25°C               100 minutes

    Zepoxy RER AW106 and Zepoxy REH 953U is a two-component epoxy adhesive system comprising of resin Zepoxy RER AW106 and hardener Zepoxy REH 953U. The adhesive is moderately reactive and cures at temperatures between 20°C to 180°C without the release of volatile components. It provides excellent adhesion and is suitable for bonding a variety of substrates.

    APPLICATIONS  

    The system is suitable for gluing FRP, wood, ceramic, glass, metallic components etc.

    TECHNICAL DATA

    Zepoxy RER AW106

    PropertyTest MethodUnitsSpecifications
    AppearanceVisual
    *ColorASTM D 1544Gardner2 max.
    *Epoxy Equivalent Weight (EEW)ASTM D 1652gm/eq200-230
    *Viscosity @ 25°CASTM D 2196cPs30,000-55,000
    *Specific Gravity @ 25°CTEC-AS-P-0041.15

    *Typical results under laboratory conditions

    Zepoxy REH 953U

    PropertyTest MethodUnitsSpecifications
    AppearanceVisual
    *ColorASTM D 1544Gardner12 max.
    *Epoxy Equivalent Weight (EEW)ASTM D 1652mg KOH/g300-350
    *Viscosity @ 25°CASTM D 2196cPs30,000 – 55,000
    *Specific Gravity @ 25°CTEC-AS-P-0040.95

    *Typical results under laboratory conditions

    MIX PROPERTIES

    Mix ratio (Part A: Part B) Theoretical100: 80
    *Mix viscosity @ 25°CASTM D 219630,000 – 55,000 cPs
    *Flash PointASTM D 93>135°C
    *Pot life (300g mix) @ 30°C30m @ 28⁰C
    *Gel time (18g mix) @ 30°C2h @ 28⁰C

    *Typical results under laboratory conditions

    CURED SYSTEM PROPETIES

    Property

    Test MethodResult
    *Flexural StrengthASTM D 79066.9 MPa
    *Compressive Strength – YieldASTM D 69565.4 MPa
    *Compressive Strength – UltimateASTM D 695116.2 MPa

    *Typical results under laboratory conditions

    GENERAL INFORMATION

    Substrate preparation: The substrate of the substrate must be clean and dry. Remove all dirt, grease and foreign material by cleaning with suitable solvent, sand blasting, mechanical abrasion, or acid etching.

    Mixing: To obtain good results, thorough mixing of the ingredients is essential. Usually, the resin and hardener are mixed in small quantities to extend the working time and prevent high exothermic reaction and pre-gelling.

    Application: To ensure good adhesion between the substrates, it is recommended to apply rich layer of homogenous blend uniformly on the surface and fill the dents and pinholes. Adequate cuing normally takes place within 24 hours, post curing at temperatures more than 40°C is recommended.

    CLEANING AND MAINTENANCE OF EQUIPMENT

    Tools and equipment used during the process are best cleaned immediately after use since removal of cured resin is difficult and time consuming. It is recommended that the bulk of the resin be removed using a scrapper and the remainder washed away using solvents such as toluene, xylene, or acetone.

    PAKAGING

    Zepoxy RER AW106 & Zepoxy REH 953U are available as follows:

    1 KG, 5KG, 15KG, 30KG, and 200KG

    HEALTH AND SAFETY

    Dispose containers of the materials as per local laws, rules, and regulations. Use gloves, safety masks and other safety apparel as per health and safety laws. For further assistance, please refer to the MSDS of the product for further health and safety information.

    Packaging

    1 KG, 5 KG, 10 KG, 15 KG, 30 KG, 200 KG


Product Description

Zepoxy RER AW106           100 Parts by Weight
Zepoxy REH AW106           80 Parts by Weight
Pot life at 25°C               100 minutes

Zepoxy RER AW106           100 Parts by Weight
Zepoxy REH AW106           80 Parts by Weight
Pot life at 25°C               100 minutes

Zepoxy RER AW106 and Zepoxy REH 953U is a two-component epoxy adhesive system comprising of resin Zepoxy RER AW106 and hardener Zepoxy REH 953U. The adhesive is moderately reactive and cures at temperatures between 20°C to 180°C without the release of volatile components. It provides excellent adhesion and is suitable for bonding a variety of substrates.

APPLICATIONS  

The system is suitable for gluing FRP, wood, ceramic, glass, metallic components etc.

TECHNICAL DATA

Zepoxy RER AW106

PropertyTest MethodUnitsSpecifications
AppearanceVisual-
*ColorASTM D 1544Gardner2 max.
*Epoxy Equivalent Weight (EEW)ASTM D 1652gm/eq200-230
*Viscosity @ 25°CASTM D 2196cPs30,000-55,000
*Specific Gravity @ 25°CTEC-AS-P-004-1.15

*Typical results under laboratory conditions

Zepoxy REH 953U

PropertyTest MethodUnitsSpecifications
AppearanceVisual-
*ColorASTM D 1544Gardner12 max.
*Epoxy Equivalent Weight (EEW)ASTM D 1652mg KOH/g300-350
*Viscosity @ 25°CASTM D 2196cPs30,000 – 55,000
*Specific Gravity @ 25°CTEC-AS-P-004-0.95

*Typical results under laboratory conditions

MIX PROPERTIES

Mix ratio (Part A: Part B) Theoretical100: 80
*Mix viscosity @ 25°CASTM D 219630,000 – 55,000 cPs
*Flash PointASTM D 93>135°C
*Pot life (300g mix) @ 30°C-30m @ 28⁰C
*Gel time (18g mix) @ 30°C-2h @ 28⁰C

*Typical results under laboratory conditions

CURED SYSTEM PROPETIES

Property

Test MethodResult
*Flexural StrengthASTM D 79066.9 MPa
*Compressive Strength – YieldASTM D 69565.4 MPa
*Compressive Strength – UltimateASTM D 695116.2 MPa

*Typical results under laboratory conditions

GENERAL INFORMATION

Substrate preparation: The substrate of the substrate must be clean and dry. Remove all dirt, grease and foreign material by cleaning with suitable solvent, sand blasting, mechanical abrasion, or acid etching.

Mixing: To obtain good results, thorough mixing of the ingredients is essential. Usually, the resin and hardener are mixed in small quantities to extend the working time and prevent high exothermic reaction and pre-gelling.

Application: To ensure good adhesion between the substrates, it is recommended to apply rich layer of homogenous blend uniformly on the surface and fill the dents and pinholes. Adequate cuing normally takes place within 24 hours, post curing at temperatures more than 40°C is recommended.

CLEANING AND MAINTENANCE OF EQUIPMENT

Tools and equipment used during the process are best cleaned immediately after use since removal of cured resin is difficult and time consuming. It is recommended that the bulk of the resin be removed using a scrapper and the remainder washed away using solvents such as toluene, xylene, or acetone.

PAKAGING

Zepoxy RER AW106 & Zepoxy REH 953U are available as follows:

1 KG, 5KG, 15KG, 30KG, and 200KG

HEALTH AND SAFETY

Dispose containers of the materials as per local laws, rules, and regulations. Use gloves, safety masks and other safety apparel as per health and safety laws. For further assistance, please refer to the MSDS of the product for further health and safety information.