Zepoxy Electro Pot Low viscosity, High gloss, electronic component potting adhesive.
Zepoxy Electro Pot Low viscosity, High gloss, electronic component potting adhesive.
TECHNICAL TABLE AND TYPICAL PROPERTIES
Property
Test Method
Result
Appearance Part A
-
Low viscosity, black liquid
Appearance Part B
-
Low viscosity, pale yellow to orange liquid
Viscosity @ 25°C Part A
ASTM D 2196-05
5,000 – 10,000
Viscosity @ 25°C Part B
ASTM D 2196-05
300 – 600
Mix ratio (Part A: Part B)
ASTM D 2074
100: 23
Pot life (300g mix) @ 25°C
-
1h
Pot life (300g mix) @ 42°C
-
21m
Gel time (24.6g mix) @ 30°C
-
3h
Hardening time
-
24h
Mix density @ 30°C
ASTM D 1475-98
1.48 g/cc
Flexural Strength
ASTM D 790
31 MPa
Compressive Strength - Yield
ASTM D 695
44 MPa
Compressive Strength - Ultimate
ASTM D 695
55.8 MPa
These are typical results under laboratory conditions, actual coverage and timings may vary as per actual working environment.
USAGE GUIDELINE
Premix Part A at high speed with a mechanical mixer for 5 minutes, then add Part B and further mix at medium speed for 5 minutes. After pouring the mix in the electronic components, generated foam will finish by itself after some time. Once the epoxy is tack-free, for superior final performance post-cure it at elevated temperature for 2-4 hours.
PAKAGING
Zepoxy Electro Pot is available as follows:
1.23 KG Set Part A: 1 KG Part B: 230g
24.6 KG Set Part A: 20 KG Part B: 4.6 KG
HEALTH AND SAFETY
Dispose containers of the materials as per local laws, rules, and regulations. Use gloves, safety masks and other safety apparel as per health and safety laws. For further assistance, please refer to the MSDS of the product for further health and safety information.
