Zepoxy Electro Flex
Zepoxy Electroflex is a specially designed electronic component potting adhesive which gives a clear, bubble-free finish with high flexibility.
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Zepoxy Tabletop Deep Pour is a retarded clear epoxy casting system, which offers a long open time for precise article placement and complete bubble removal. It has inbuilt UV inhibitors as well as excellent visual properties. It also avoids high exothermic reaction and the resulting shrinkage after curing.
Zepoxy Electroflex is a specially designed electronic component potting adhesive which gives a clear, bubble-free finish with high flexibility.e
These are typical results under laboratory conditions, actual coverage and timings may vary as per actual working environment.
|Appearance Part A||-||Clear liquid|
|Appearance Part B||-||Clear liquid|
|Viscosity @ 25°C Part A||ASTM D 2196-05||2,000 – 3,500|
|Viscosity @ 25°C Part B||ASTM D 2196-05||100 – 200|
|Mix ratio (Part A : Part B)||ASTM D 2074||100: 100|
|Pot life (300g mix) @ 30°C||-||40m|
|Gel time (20g mix) @ 30°C||-||3h|
|Mix density @ 30°C||ASTM D 1475-98||1.10 g/cc|