Zepoxy Electro Flex

Zepoxy Electroflex is a specially designed electronic component potting adhesive which gives a clear, bubble-free finish with high flexibility.

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    Zepoxy Electroflex is a specially designed electronic component potting adhesive which gives a clear, bubble-free finish with high flexibility.e

    TECHNICAL DATA

    Property Test Method Result
    Appearance Part A – Clear liquid
    Appearance Part B – Clear liquid
    Viscosity @ 25°C Part A ASTM D 2196-05 2,000 – 3,500
    Viscosity @ 25°C Part B ASTM D 2196-05 100 – 200
    Mix ratio (Part A : Part B) ASTM D 2074 100: 100
    Pot life (300g mix) @ 30°C – 40m
    Gel time (20g mix) @ 30°C – 3h
    Mix density @ 30°C ASTM D 1475-98 1.10 g/cc

    These are typical results under laboratory conditions, actual coverage and timings may vary as per actual working environment.

    USAGE GUIDELINE

    Add Part A and Part B and mix at medium speed for 5 minutes, carefully so that bubbles are not produced. After pouring the mix in the electronic components, the foam generated will be finish after some time without any agitation or intervention, incase the bubbles persist, flame torch can be used. Once the epoxy is tack-free, for superior final performance post-cure it at an elevated temperature for 2-4 hours.

    PAKAGING

    Zepoxy Electroflex is available as follows:

    2 KG Sets                         Part A: 1 KG
    Part B: 1 KG

    30 KG Sets                      Part A: 15KG
    Part B: 15 KG

    HEALTH AND SAFETY

    Dispose containers of the materials as per local laws, rules, and regulations. Use gloves, safety masks and other safety apparel as per health and safety laws. For further assistance, please refer to the MSDS of the product for further health and safety information.

    Packaging

    2 KG, 30 KG
Technical Datasheet
Product Description
Zepoxy Tabletop Deep Pour is a retarded clear epoxy casting system, which offers a long open time for precise article placement and complete bubble removal. It has inbuilt UV inhibitors as well as excellent visual properties. It also avoids high exothermic reaction and the resulting shrinkage after curing.
Zepoxy Electroflex is a specially designed electronic component potting adhesive which gives a clear, bubble-free finish with high flexibility.e

TECHNICAL DATA

Property Test Method Result
Appearance Part A - Clear liquid
Appearance Part B - Clear liquid
Viscosity @ 25°C Part A ASTM D 2196-05 2,000 – 3,500
Viscosity @ 25°C Part B ASTM D 2196-05 100 – 200
Mix ratio (Part A : Part B) ASTM D 2074 100: 100
Pot life (300g mix) @ 30°C - 40m
Gel time (20g mix) @ 30°C - 3h
Mix density @ 30°C ASTM D 1475-98 1.10 g/cc
These are typical results under laboratory conditions, actual coverage and timings may vary as per actual working environment.

USAGE GUIDELINE

Add Part A and Part B and mix at medium speed for 5 minutes, carefully so that bubbles are not produced. After pouring the mix in the electronic components, the foam generated will be finish after some time without any agitation or intervention, incase the bubbles persist, flame torch can be used. Once the epoxy is tack-free, for superior final performance post-cure it at an elevated temperature for 2-4 hours.

PAKAGING

Zepoxy Electroflex is available as follows: 2 KG Sets                         Part A: 1 KG Part B: 1 KG 30 KG Sets                      Part A: 15KG Part B: 15 KG

HEALTH AND SAFETY

Dispose containers of the materials as per local laws, rules, and regulations. Use gloves, safety masks and other safety apparel as per health and safety laws. For further assistance, please refer to the MSDS of the product for further health and safety information.