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This section provides details on Polyamide Hardeners of different grades.
Zepoxy RER AW106 and Zepoxy REH 953U is a two-component epoxy adhesive system comprising of resin Zepoxy RER AW106 and hardener Zepoxy REH 953U. The adhesive is moderately reactive and cures at temper... read more
Zepoxy REH 120 is a high viscosity reactive polyamide used as curing agent for liquid or solution grade epoxy resins such as Zepoxy RER 128 to produce room temperature curable adhesives and coatings. ... read more
Zepoxy REH 140 is a medium viscosity reactive polyamide with high imidazoline content used as a curing agent for liquid or solution grade epoxy resins such as Zepoxy RER 128 or Zepoxy RER 011 X 75 to ... read more
Zepoxy REH 125 is a medium viscosity reactive polyamide with high imidazoline content used as a curing agent for liquid or solution grade epoxy resins such as Zepoxy RER 128 or Zepoxy RER 011 X 75 to ... read more
Zepoxy REH 115 is high viscosity reactive polyamide curing agent with high imidazole content for Epoxy Resin to be used in various adhesive and coating applications. read more
Zepoxy REH 145 / 145M are medium viscosity reactive polyamides with high imidazoline content used as curing agents for liquid or solution grade epoxy resins such as Zepoxy RER 128 or Zepoxy RER 011 X ... read more
Zepoxy REH 145M / 145 are medium viscosity reactive polyamides with high imidazoline content used as curing agents for liquid or solution grade epoxy resins such as Zepoxy RER 128 or Zepoxy RER 011 X ... read more
Zepoxy REH 147 is a medium viscosity reactive polyamide used as curing agent for liquid or solution grade epoxy resins such as Zepoxy RER 128 or Zepoxy RER 011 X 75 to produce room temperature curable... read more
Zepoxy REH 115 X70 is a low viscosity solvent-based reactive polyamide curing agent for epoxy resin to be used in various applications. read more
Zepoxy REH 115 MX B70 is a specially modified polyamide solution with excellent curing in high humidity/low temperature environments and excellent adhesion to damp substrates. It can be used with RER ... read more
