Zepoxy Electropot

Zepoxy Electro Pot Low viscosity, High gloss, electronic component potting adhesive.

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    Zepoxy Electro Pot
    Low viscosity, High gloss, electronic component potting adhesive.

    TECHNICAL  TABLE AND TYPICAL PROPERTIES

    Property Test Method Result
    Appearance Part A Medium viscosity, black liquid
    Appearance Part B Low viscosity, pale yellow to orange liquid
    Viscosity @ 25°C Part A ASTM D 2196-05 15,000 – 20,000
    Viscosity @ 25°C Part B ASTM D 2196-05 300 – 600
    Mix ratio (Part A: Part B) ASTM D 2074 100: 23
    Pot life (300g mix) @ 30°C 1h 30m
    Pot life (300g mix) @ 42°C 21m
    Gel time (24.6g mix) @ 30°C 3h 40m
    Hardening time 24h
    Mix density @ 30°C ASTM D 1475-98 1.48 g/cc
    Flexural Strength ASTM D 790 28 MPa
    Compressive Strength – Yield ASTM D 695 41 MPa
    Compressive Strength – Ultimate ASTM D 695 52.6 MPa

    These are typical results under laboratory conditions, actual coverage and timings may vary as per actual working environment.

    USAGE GUIDELINE

    Premix Part A at high speed with a mechanical mixer for 5 minutes, then add Part B and further mix at medium speed for 5 minutes. After pouring the mix in the electronic components, generated foam will finish by itself after some time. Once the epoxy is tack-free, for superior final performance post-cure it at elevated temperature for 2-4 hours.

    PAKAGING

    Zepoxy Electro Pot is available as follows:

    1.23 KG Set                Part A: 1 KG
                                      Part B: 230g

    24.6 KG Set               Part A: 20 KG
                                     Part B: 4.6 KG

    HEALTH AND SAFETY

    Dispose containers of the materials as per local laws, rules, and regulations. Use gloves, safety masks and other safety apparel as per health and safety laws. For further assistance, please refer to the MSDS of the product for further health and safety information.

    Packaging

    1.23 KG, 24.6 KG


Product Description

Zepoxy Electro Pot
Low viscosity, High gloss, electronic component potting adhesive.

Zepoxy Electro Pot
Low viscosity, High gloss, electronic component potting adhesive.

TECHNICAL  TABLE AND TYPICAL PROPERTIES

Property Test Method Result
Appearance Part A - Medium viscosity, black liquid
Appearance Part B - Low viscosity, pale yellow to orange liquid
Viscosity @ 25°C Part A ASTM D 2196-05 15,000 – 20,000
Viscosity @ 25°C Part B ASTM D 2196-05 300 – 600
Mix ratio (Part A: Part B) ASTM D 2074 100: 23
Pot life (300g mix) @ 30°C - 1h 30m
Pot life (300g mix) @ 42°C - 21m
Gel time (24.6g mix) @ 30°C - 3h 40m
Hardening time - 24h
Mix density @ 30°C ASTM D 1475-98 1.48 g/cc
Flexural Strength ASTM D 790 28 MPa
Compressive Strength - Yield ASTM D 695 41 MPa
Compressive Strength - Ultimate ASTM D 695 52.6 MPa

These are typical results under laboratory conditions, actual coverage and timings may vary as per actual working environment.

USAGE GUIDELINE

Premix Part A at high speed with a mechanical mixer for 5 minutes, then add Part B and further mix at medium speed for 5 minutes. After pouring the mix in the electronic components, generated foam will finish by itself after some time. Once the epoxy is tack-free, for superior final performance post-cure it at elevated temperature for 2-4 hours.

PAKAGING

Zepoxy Electro Pot is available as follows:

1.23 KG Set                Part A: 1 KG
                                  Part B: 230g

24.6 KG Set               Part A: 20 KG
                                 Part B: 4.6 KG

HEALTH AND SAFETY

Dispose containers of the materials as per local laws, rules, and regulations. Use gloves, safety masks and other safety apparel as per health and safety laws. For further assistance, please refer to the MSDS of the product for further health and safety information.